Jin-liang, GUO Quan-gui, ZHONG Ya-juan, GAO Xiao-qing, FENG Zhi-hai, FAN Z, . Thermophysical properties of high-density graphite foams and their paraffin composites. New Carbon Mater., 2012, 27(1): 27-34. doi: DOI: 10.1016/S1872-5805(12)600
Citation: Jin-liang, GUO Quan-gui, ZHONG Ya-juan, GAO Xiao-qing, FENG Zhi-hai, FAN Z, . Thermophysical properties of high-density graphite foams and their paraffin composites. New Carbon Mater., 2012, 27(1): 27-34. doi: DOI: 10.1016/S1872-5805(12)600

Thermophysical properties of high-density graphite foams and their paraffin composites

doi: DOI: 10.1016/S1872-5805(12)600
Funds:  The research is supported by the National Basic Research Program of China (2011CB605802).
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  • Author Bio:

    SONG Jin-liang (1982-), male, Ph.D. Student, engaged in the research and development of new carbon materials. E-mail: jlsong1982@yeah.net

  • Corresponding author: GUO Quan-gui. Tel: +86-351-4084106, Fax: +86-351-4083952
  • Accepted Date: 2012-07-20
  • Publish Date: 2012-02-20
  • High-density graphite foams (GFs) were prepared from mesophase pitch with or without mesocarbon microbeads at different foaming temperatures and pressures, followed by carbonization and graphitization at 1273 and 2973K, respectively. In one case, pitch was repeatedly infiltrated into the graphitized foam at 573K followed by carbonization to increase its density. Paraffin was infiltrated into the GFs to form GF/paraffin composites. Factors determining the thermophysical properties of the GFs and thermal behavior of the GF/paraffin composites were investigated. The microstructure and thermophysical properties of the foams were found to be greatly influenced by the pitch fraction, foaming temperature and foaming pressure. The thermal conductivity of the foams determines the thermal behavior of the GF/paraffin composites. The thermal diffusivity of the GF/paraffin composites investigated can be increased 768 to 1588-fold compared with that of paraffin. The latent heat of the composites has an almost linear relationship with the mass fraction of paraffin in the composites. The composites are suitable candidates for passive cooling of electronics.
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